High Voltage Generator
The circuit serves to generate high-frequency high-voltage fields in the surface coating. At the same time, it was necessary to deal with comparatively high currents as well as the requirements regarding air and creepage distances as well as the small space available. The signal processing took place impedance-controlled. With base materials of highest CTI values (≥600) in connection with Wirelaid all this could be realized. Pleasant side effect: a cheaper PCB with a simpler structure compared to conventional approaches.
» Perfection is finally attained not when there is no longer anything to add but when there is no longer anything to take away. «
— Antoine de Sainte-Exupéry, French aviator and writer (1900-1944)
NEWS
High Voltage Generator
The circuit serves to generate high-frequency high-voltage fields in the surface coating. At the same time, it was necessary to deal with comparatively high currents as well as the requirements regarding air and creepage distances as well as the small space available. The signal processing took place impedance-controlled. With base materials of highest CTI values (≥600) in connection with Wirelaid all this could be realized. Pleasant side effect: a cheaper PCB with a simpler structure compared to conventional approaches.
3D camera backplane for In-Flight refueling systems
In avionics environment, highest system reliability is generally required. High robustness and mechanical stability at the lowest possible PCB weight, are properties which normally excepts each other. Wirelaid shows its strength exactly at this point. Implementation of the necessary current load, at less or equal than 40A, in a backplane with minimum use of copper and board area finally fulfilled all this requirements perfectly. Used in most modern In-Flight Refueling aircrafts of the world market, Wirelaid also shows that it is not only limited and beneficial at highest currents and power.
The project was honoured with the Award for Project Excellence.
DC-AC Bridge Converter with Phase Currents up to 400Amps
The challenges of this circuit brought WIRELAID again in new dimensions. The power and thermal management could only be integrated in a relatively small, already fixed in advance, round, housing space. The allowable temperature increases during operation were furthermore kept within narrow limits. And for such applications, extremely low number of used copper layers, the combination of power and signals in each of the outer layers, an optimum heat transfer could be achieved through the PCB. The required parameters were clearly achieved even at full load of 400A.
TECHNOLOGY
LESEN SIE ALLES ÜBERE UNSERE TECHNOLOGIE & DESIGNREGELN
PRODUCTS
- WIRELAID 3D
- WIRELAID POWER
- WIRELAID SHUNT
- WIRELAID POWERFLEX
- PRODUCT VIDEO
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THINK AROUND THE CORNER - WIRELAID 3D
In the WIRELAID 3D PCB is milled perpendicular to the inserted wires a straight groove, z-axis controlled. In this groove, the circuit board can be bent up to 135 °. Due to the current tracks directly through the kink, expensive and partly error-prone plug connections are now redundant.
In the application, WIRELAID is a comparable approach to the 3D rigid-flex / Semi-Flex technology. For applications with only 1-2 required bending cycles, however, show large differences. No minimum bending radius, no additional materials or area milling, yields significant cost advantages.
Using the WIRELAID 3D technology can be e.g. also provide completely closed systems from a single circuit board.
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HIGH CURRENTS - WIRELAID POWER
Bring high and very high currents to the PCB - this trend is unmistakable. Combining this with small line-space ratios, smallest components and low circuit volume is usually goal of the hardware engineers.
Wirelaid Power provides its technical potential right here. Within the PCB, partial additional cross sections are placed by use of flat wires. In this way the necessary high current paths were realized easily and efficiently.
Usage of Wirelaid creates additional routing area, reduces the number of layers and / or the copper-base foil thickness, in each case. The result is a technically equivalent product at a lower cost.
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WIRELAID SHUNT
In the printed circuit board integrated Current Sense Resistors replace the discrete component. The otherwise customary in Wirelaid copper flat wires are replaced by flat wires of resistance wire with a very low temperature coefficient.
The result is a fully integrated resistor which is tunable during the manufacturing process, with a low-resistance for indirect measurement of currents in the conductor path.
External mounting and its logistics repeals, more routing area is free and the shunt doesn’t change its value by external influences.
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WIRELAID POWERFLEX
Powerflex is a semi-flexible standard application that is combined with Wirelaid. The Semiflex feature remains, but extends around the property of the high-current capability up to 100A, especially in the bending area.
The decisive advantage comes from combining conventionally etched structures, such as for data lines, and Wirelaid tracks for power supply or drivers.
Additional mechanical stability through the flat wires in the bending area increases safety during installation and operation.
USAGE
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Energy Recovery Control Module
Specific values:
Current max. effective: 87A, Peak (10s) 150A
Maximum temperature rise: ΔT: + 40 K
Ambient temperature: app. 25°C
Conventional device:
Thick copper
Number of PCB: 1
Number of layers: 6, @ 2 x 400µm inner layers and 4 x 35µm remaining layers
Results with WIRELAID Power:
Reduction of base copper thickness to 105µm at power planes
No special technologies necessary
Temperature rise in operation with Wirelaid max.: 25K
Adjustment of the mounting and welding lines is not required.
Less copper amount
Significantly cheaper production
View wire layer
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Line Filter for Power Supply
Specific values:
Current max. effective: 33A
Maximum temperature rise: ΔT: + 20 K
Ambient temperature: 25°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 4, @ 4 x 70µm,
wires at only one outer layer
Results with WIRELAID Power:
Reduction of base copper thickness to 70µm
Avoid of 105μm solution with the same area
Temperature rise in operation with Wirelaid max.: 20K
Only few wires necessary
Increase of the device output power at a constant size.
Very cost-effective production
View wire layer
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SMT MOS FET Regulator
Specific values:
Current max. effective: 80A
Maximum temperature rise: ΔT: + 20 K
Ambient temperature: app.50°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 6, @ 4 x 105µm inner layers and 2 x 70µm outer layers
Results with WIRELAID Power:
Reduction of base copper thickness to 70µm
Reduction of layers from 6 to 4, WIRELAID at both outer layers.
Temperature rise in operation with Wirelaid max.: <20K
Small total area
Complete SMD compatible outer layers in combination with Easy EMS
View wire layer
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DC Hub Speed Control Module
Specific values:
Current max. effective: 30A, 350W
Maximum temperature rise: ΔT + 30 K
Ambient temperature: max. 100°C
Old device:
Conventional PCB, Area 40 x 50 mm2
Number of PCB: 1
Number of layers: 6, @ 4 x 105µm inner layers and 2 x 35µm outer layers
Request: increase the output to 600W, 50A with the same size
Results with WIRELAID Power:
Reduction of base copper thickness, 5µm outer, 70µm inner layers
Reduction of layers from 6 to 4, WIRELAID at both inner layers.
Temperature rise in operation with Wirelaid max.: 25K
Constant PCB area!
Redoubled power dissipation
Cheaper PCB with higher power output
View wire layer
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Current distributor with I-Sense
Specific values:
Current max. effective: total 120A
Maximum temperature rise: ΔT: + 30 K
Ambient temperature: app.80°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 4, @ 2 x 105µm inner layers and 2 x 70µm outer layers
Results with WIRELAID Power:
Reduction of base copper thickness to 70µm in the inner layers
Reduction of layers from 6 to 4, WIRELAID at both inner layers.
Temperature rise in operation with Wirelaid max.: 25K
Use of Power Elements as Pressfits
View wire layer
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Power Supply for AC Servo
Specific values:
Current max. effective: 65A
Maximum temperature rise: ΔT: + 20 K
Ambient temperature: app. 25°C
Original device:
Multilayer Stackup
Number of PCB: 1
Number of layers: 8, @ 4 x 105µm inner layers and 4 x 70µm remaining layers
Results with WIRELAID Power:
Reduction of base copper thickness, to 70µm
Reduction of layers from 8 to 4, WIRELAID at one inner layer.
Temperature rise in operation with Wirelaid max.: 20K
Saving of 2 complete cores
Only some critical nets need to be reinforced with wires
PCB layout and assembly remains unchanged.
View wire layer
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High Current Power Distribution PCB
Specific values:
Current max. effective: 120A
Maximum temperature rise: ΔT: + 20 K
Ambient temperature: up to 100°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 6, @ 6 x 105µm
Results with WIRELAID Power:
Reduction of base copper thickness, to 70µm
Reduction of layers from 6 to 4, WIRELAID at both inner layers.
Temperature rise in operation with Wirelaid max.: 20K
Combination with solderless Power Pressfit Elements
Increase of the device output power at a constant size.
PCB manufacturing at lower price level
Lower PCB area
View wire layer
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Secondary Power Module
Specific values:
Current max. effective: 200A, peak (5s) 250A
Maximum temperature rise: ΔT: + 35 K
Ambient temperature: app. 60°C
Previous device:
Conventional thick copper stackup
Number of PCB: 1
Number of layers: 6, @ 4 x 210 µm inner layers and 2 x 70µm outer layers
Results with WIRELAID Power:
Reduction of base copper thickness, to 70µm
Reduction of layers from 6 to 4, WIRELAID at both inner layers.
Temperature rise in operation with Wirelaid max.: 20K
Strongly improved soldering conditions
No new housing necessary (railway: existing device box!)
View wire layer
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Multiphase Torque Control Module
Specific values:
Current max. effective: 120A
Maximum temperature rise: ΔT: + 30 K
Ambient temperature: app.80°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 6, @ 4 x 105µm inner layers and 2 x 70µm outer layers
Results with WIRELAID Power:
Reduction of base copper thickness, to 70µm
Reduction of layers from 6 to 4, WIRELAID at solder and component layer.
Temperature rise in operation with Wirelaid max.: 25K
Adjustment of the mounting and welding lines is not required.
Increase of the device output power at a constant size.
More power at same size of device.
PCB layout and assembly remains unchanged.
View wire layer
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Fully Electronic Car Steering
Specific values:
Current load I eff: 75A, Peak (1s): 120A
Maximum temperature rise: 15K
Ambient temperarture range: - 40°C to +85°C
New developed device:
Wirelaid PCB
Number of PCB: 1
Number of layers / Cu thickness: 4 x 70µm
Results with WIRELAID Power:
Replacement of a thick copper design 6 x 105µm, thereby smaller line / space ratio
Easier manufacturing and lower copper amount
Saving of a complete core, means 2 layers
Power- and control electronic on one single PCB fully integrated.
Combination with powerelements in presfit technology.
View wire layer
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Pitch Control Module Wind Turbine
Specific values:
Current max. effective: 75A, Peak (10s): 150A
Maximum temperature rise: ΔT: + 40 K
Ambient temperature: 0 - 30°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 6, @ 2 x 400µm inner layers and 4 x 105µm remaining layers
Results with WIRELAID Power:
Reduction of base copper thickness, all layers 35µm
Reduction of layers from 6 to 4, WIRELAID at inner layers.
Temperature rise maximum at rated current, max.: 25K
Adjustment of the mounting and welding lines is not required.
Increase of the device output power at a constant size.
No changes to the mechanical components such as housings and heatsinks.
PCB layout and assembly remains unchanged.
View wire layer
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AC Servocontroller
Specific values:
Current max. effective: 50A
Maximum temperature rise: ΔT: + 30 K
Ambient temperature: app.55°C
Conventional device:
Multilayer, Cable strands with solder joints, hand soldering
Number of PCB: 2
Number of layers: 4, @ 4 x 70µm
Results with WIRELAID Power:
Integration of both PCBs to one
Complete integration of control systems and power equipment at the bending edge
Avoid of hand soldering
Assembly of both PCBs together possible
Strong cost reduction
PCB layout and assembly remains nearly unchanged.
View wire layer
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Switch Carrier Unit
Specific values:
Current max. effective: 12A
Maximum temperature rise: ΔT: + 30 K
Ambient temperature: app.25°C
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 4, @ 4 x 35µm
Results with WIRELAID Power
Out of 3 single PCBs Wirelaid made only one
Simple handling, EMS and assembly
No separate PCB connectors to use
Cost reduction about 20%
View wire layer
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Dynamic vehicle door sill trims Lighting
Specific values:
Device with complete µP controller and wireless connection
Flattest construction necessary PCB height 0,8mm
LEDs are perpendicular to the vertical assembly
Old device:
Flexjumper solution
Number of PCB: 2
Number of layers: 4, @ 4 x 35µm
Results with WIRELAID 3d:
Extremely low construction possible, only slightly higher than the LED components
LED signals are transmitted exclusively through wires
Only one single PCB
Easy handling and assembly
View wire layer
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LED Helix Light
Specific values:
Complicated geometrical arrangement of RGB Led
Microcontroller on the PCB in fine pitch
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of Layers/Cu thickness: 4 x 35µm
Results with Wirelaid 3D:
All the individual elements of the LED carrier with Wirelaid 3d connected
No PCB connector, plug or similar elements
Helix structure by slightly bending, stable at the depth milling and easy to reach
Simple LP handling, assembly and Stack up
View wire layer
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IGBT Module with Wireless Connection
Specific values:
Current max. effective: 40A
Maximum temperature rise: ΔT: + 25 K
Ambient temperature: RT
New developed device:
WIRELAID PCB
Number of PCB: 1
Number of layers: 6, @ 4 x 70µm inner layers and 2 x 35µm outer layers
Results with WIRELAID Power:
Stack up unchanged
Separate antenna module is integrated on the PCB border with Wirelaid 3d
Only one PCB
Much easier logistics and assembly
No PCB connecting elements
Cost reduction about 20%
View wire layer
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Amplifier for Servomotor
Specific values:
Current max. effective: 50A (@ 100% duty cycle)
Maximum temperature rise: ΔT: + 20 K
Ambient temperature: 0°C - 40°C
New devloped device:
WIRELAID PCB
Number of PCB: 1
Number of layers 4
Base copper thickness 4 x 70µm
Results with WIRELAID 3D:
Increase of device output power from 5,5kW to 7,5kW at constant size of housing.
Advantages in manufacturing and costs by eliminating a 2 PCBs and all connectors.
Power-, interface-, and control electronics on one single PCB without any connectors.
View wire layer
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Amplifier for Servo Motor Driver
Specific values:
Effecitve current: 12A
Maximum temperature rise: 10K
Temperature working environment: 0° C up to 40° C
New developed device:
Application in WIRELAID
Only one PCB
Number of layers: 4
Base copper thickness: 70µm
Results with WIRELAID 3D & Power:
Substitution of a stamp grid solution in bending edge area.
Easier production and lower costs by integrating on a PCB and saving a connector or punch grid.
Power- and control electronic on one single PCB fully integrated.
Saving PCB routing area by Wirelaid Power at the bottom side.
View wire layer
CONTACT
Wirelaid PCB is a development of JUMATECH GmbH. Technology and uses are protected by patents.
CONTACT
Tel.: +49 (0) 9126 2959 - 10
Fax: +49 (0) 9126 2959 - 18
E-Mail: info@jumatech.com
ADDRESS
JUMATECH GmbH
Naabstraße 4
90542 Eckental
Deutschland
LEGAL NOTICE
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Jumatech
Naabstraße 4
90542 Eckental
Represented by
Markus Wölfel
Contact
Telephone: +49 (0) 9126 2959 - 10
Telefax: +49 (0) 9126 2959 - 18
Email: info@jumatech.com
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